硬件工程師英文簡歷表格

硬件工程師英文簡歷表

每一個求職者想要贏得招聘單位的認(rèn)可，首先需要展示自己獨特的競爭力，可以依靠簡歷向招聘方突出自己的優(yōu)勢，讓招聘單位覺得求職者勝任這份工作。只要能得到招聘方的認(rèn)可，求職者獲得工作機(jī)會的概率就很大。

任何企業(yè)在招聘時都希望招聘到有豐富工作經(jīng)驗的求職者。高素質(zhì)人才不僅需要有高學(xué)歷，還需要有豐富的經(jīng)驗。有經(jīng)驗的員工可以在更短的時間內(nèi)完成所有工作，有效降低企業(yè)運(yùn)營成本。所以企業(yè)在招聘的時候更看重簡歷的工作經(jīng)歷內(nèi)容，任何信息都可以忽略，但是在填寫工作經(jīng)歷的時候一定要慎重。通過填寫與招聘崗位相似的工作經(jīng)歷，可以達(dá)到更好的求職效果。

求職者是否有豐富的經(jīng)驗，直接影響到他能否得到一份滿意的工作。在參與實際競爭時，在簡歷的具體內(nèi)容中突出自己豐富的工作經(jīng)驗，可以增加用人單位對自己的認(rèn)可，從而達(dá)到提高求職者競爭力的效果，幫助求職者在更短的時間內(nèi)找到滿意的工作單位。所以寫簡歷的時候要注意。更多信息請繼續(xù)關(guān)注你的簡歷網(wǎng)站。

Name：yjbysHukou：Residency：ShanghaiWork Experience：Current Salary：Tel：E-mail：ruiwen/jianliCareer ObjectiveDesired Industry：Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, CertificationDesired Position：Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist StaffDesired address：Shanghai ,Hongkong ,Beijing ,Taiwan ,MacaoDesired Salary：NegotiableWork Experience2006/06—Present***CompanyIndustry: Electronics/Semiconductor/ICIntel Flash Engineering Department Individual Contributor Responsibilities：I have been working in Intel Flash Assembly & Test EngineeringDepartment as an Individual Contributor since June of 2006.Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off:1.The yield of year 2006 has been dramatically increased than that of year 2005.2.The yield of all products, consecutively meets the goal.3.The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.Report Directly to: Department ManagerNumber of Subordinate: 14Reference: Bao PowelAchievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.Our efforts are paid off:1.The yield of year 2006 has been dramatically increased than that of year 2005.2.The yield of all products, consecutively meets the goal.3.The total amount of cost saving due to yield improvement is more than $1 million compared with year 2005. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 2007.2006/01—2006/05Intel(Shanghai) Technology Development Ltd. CompanyIndustry: Electronics/Semiconductor/ICIntel STTD-China Department Electronics Development Engineer Responsibilities：1.I had been working in STTD-China since Jan 2006 to May 2006 as a senior module engineer.2.At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time.Report Directly to: Hopman MarkNumber of Subordinate: 14Reference: Bao PowelReason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the internal re-organization in June of 2006.Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.2005/05—2006/01Nanyang University of Science & TechnologyIndustry: Electronics/Semiconductor/ICElectronics & Electrical Engineering Department Research Fellow Responsibilities：1.I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow.2.I majored at Gate Ode Reliability Research in the duration.Report Directly to: Professor Pey Kin LeohSubordinate: 3Reference: Patrick LowReason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job.Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.Project Experience2008/01—PresentAssembly NPI (New Product Introduction)Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress.2007/01—2007/12Marginal Electrical Boards RescueProject Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally.Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress.2006/10—2007/05Optimization the current Test Process Order for Flash MemoryProject Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement.2006/05—2006/12Test Yield of Flash memory ImprovementProject Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen.Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.Education and Training 2005/05—2006/01Nanyang University of Science & Technology Microelectronics DoctorateI worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate ode Reliability research in the duration.2004/03—2005/03Seoul National University of Korea Microelectronics OthersI had been working in National Physical Lab of Seoul National University in Korea since March of 2004 to March of 2005 as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology.2001/03—2004/03Shanghai Institute of Microsystemsand Information Technology，Chinese Academy of Sciences InformationTechnology Doctorate1998/09—2001/03Nanjing University of Science & Technology Material Science and Engineering MasterBeing a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics.1993/09—1997/07Nanjing University of Science & Technology Material Science and Engineering Bachelor1997/07—1998/07Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification DepartmentProfessional SkillsLanguage Skills：English: EXCELLENTKorean:AVERAGEComputer Skills：Technology skilled 96MonthSAPunderstanding 8MonthCertificate：2000/11MCSE1999/06CET6Self-appraisal7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.

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